| Impedance series 1 |
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surface treatment：OSP
Process description: differential impedance90 ohm+/-10%，single-ended impedance50 ohm+/-10%,plugging hole in BGA area
layers：14layers board thickness：2.4mm min hole size：0.25mm line width/space：4/4mil |
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| Impedance series 2 |
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surface treatment：ENIG
Process description：differential impedance 100 ohm+/-10%，single-ended impedance 75 ohm+/-10%, plugging hole in BGA area.
layers：14layers board thickness：2.4mm min hole size：0.25mm line width/space：4/4mil |
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| Impedance series 3 |
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surface treatment：ENIG
Process description：differential impedance100 ohm+/-10%，single-ended impedance 50 ohm+/-10%, plugging hole in BGA area
layers：10层 board thickness：1.6mm min hole size：0.25mm line width/space：4/4mil |
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| Impedance series4 |
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surface treatment: HASL-LF
Process description:differential impedance 100 ohm +/- 10%,single-ended impedance 50 ohm+/-10%
layers：8layers board thickness：1.6mm min hole size：0.25mm line width/space：4/4mil |
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| High TG series |
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surface treatment：ENIG
Process description：TG=≥170℃，Plugging hole in BGA area with Blue solder mask.
layers：6层 board thickness：1.6mm min hole size：0.25mm line width/space：4/3mil |
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| LED Series |
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surface treatment：ENIG
Process description：hole to line in inner layer:3 mil
layers：2 layers board thickness：0.6mm min hole size：0.2mm line width/space：4/3mil |
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| Half plated holes series |
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surface treatment：ENIG
Process description：Halogen-free base material、plugging hole in BGA area
layers：21ayers board thickness：0.6mm min hole size：0.2mm line width/space: 4/3 mil：4/3mil |
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| Gold finger series |
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surface treatment：Flash gold/gold finger Technology description：beveling Gold finger with 20 degree/plugging hole with solder mask.
layers：四ayers Surface treatment：flash gold double sided
board thickness：1.2mm min hole size：0.35mm line width/space：4/3mil |
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