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Manufacturing Capability |
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| Product items |
Multi-layer/High Frequency Board/Aluminum substrate/Copper substrate/Double-sided board |
| common material |
FR4/CEM3/High Frequency board with different εr（both domestic and oveseas suppliers）, and other metal material. |
Board thickness
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inner core thickness 0.15-1.5 mm, finished baord thickness: 0.20-5.0 mm |
| Copper thickness |
1/3 OZ-5 OZ |
| max working panel |
600*800㎜ |
| min finished size |
3*10㎜ |
| min hole size |
0.2㎜/8mil |
| min line width |
0.075 ㎜/3mil |
| min line space |
0.1mm/4mil |
| solder mask |
LPI |
| Outer fabrication tolerance |
+/-0.1mm |
| Surface treatment |
HASL,ENIG,OSP,Selective hard gold,Immersion Tin, Immersion Silver |
| Inner Registration tolerance |
±0.05㎜ |
| lead time |
prototype 3-7 days; mass production 8-15 days |
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